Multilayer PCBs (Multilayer)
Representing more than 75% of Maxwell’s purchasing power, the multilayer PCB segment is by far our leading product. We buy more than 6,8M€ of multilayers boards each year, giving us substantial influence with our factories. We maintain more than a dozen local and off-shore factories to support this important segment from NPI through production volumes. We have developed a long standing relationship with these factories and have worked with most of them for well over 5 years. Our proven track record of high quality and on-time delivery performance highlights our dedication to customer satisfaction.
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8L multilayer - high density, fine line and space, dense BGA designing, materials: FR4 (SY1000-2M), solder mask color: blue, surface treatment: ENIG, drill to metal space: 6 mil, inner/outer layer line width and space: 2.8 mil/3 mil,
impedance tolerance: +/-7%, hole tolerance: +/-2mil, width of BGA: 10 mil
Multilayer PCBs - Technical Specification
|Feature||Maxwell´s Technical Specification|
|Layer Count||4 - 22 layers standard, 30 layers advanced, 40 layers prototype.|
|Technology Highlights||Multiple layers of epoxy glass fiber bonded together with multiple layers of copper of varying thicknesses.|
|Materials||High performance FR4, halogen-free FR4, low Df and low Dk materials|
|Copper Weights (finished)||18 μm – 210 μm, advanced 1050 μm (30 oz)|
|Minimum Trace and Gap||0.075 mm / 0.075 mm|
|PCB Thickness||0.40 mm - 7.0 mm|
|Maximum Dimensions||580 x 1080 mm, advanced 610 mm x 1400 mm|
|Surface Treatments Available||HASL (SnPb), HAL LF (SnCuNi), OSP, ENIG, ENEPIG, Immersion Tin, Immersion Silver, Flash Gold, Electrolytic gold, Gold finger|
|Minimum Mechanical Drill||0.20 mm|