Multilayer PCBs (Multilayer)
Representing more than 75% of Maxwell’s purchasing power, the multilayer PCB segment is by far our leading product. We buy more than 6,8M€ of multilayers boards each year, giving us substantial influence with our factories. We maintain more than a dozen local and off-shore factories to support this important segment from NPI through production volumes. We have developed a long standing relationship with these factories and have worked with most of them for well over 5 years. Our proven track record of high quality and on-time delivery performance highlights our dedication to customer satisfaction.
Please contact us if you need further information or assistance, we are happy to help you.
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8L multilayer - high density, fine line and space, dense BGA designing, materials: FR4 (SY1000-2M), solder mask color: blue, surface treatment: ENIG, drill to metal space: 6 mil, inner/outer layer line width and space: 2.8 mil/3 mil, impedance tolerance: +/-7%, hole tolerance: +/-2mil, width of BGA: 10 mil |
Multilayer PCBs - Technical Specification
| Feature | Maxwell´s Technical Specification |
| Layer Count | 4 - 22 layers standard, 30 layers advanced, 40 layers prototype. |
| Technology Highlights | Multiple layers of epoxy glass fiber bonded together with multiple layers of copper of varying thicknesses. |
| Materials | High performance FR4, halogen-free FR4, low Df and low Dk materials |
| Copper Weights (finished) | 18 μm – 210 μm, advanced 1050 μm (30 oz) |
| Minimum Trace and Gap | 0.075 mm / 0.075 mm |
| PCB Thickness | 0.40 mm - 7.0 mm |
| Maximum Dimensions | 580 x 1080 mm, advanced 610 mm x 1400 mm |
| Surface Treatments Available | HASL (SnPb), HAL LF (SnCuNi), OSP, ENIG, ENEPIG, Immersion Tin, Immersion Silver, Flash Gold, Electrolytic gold, Gold finger |
| Minimum Mechanical Drill | 0.20 mm |