HDI – High Density Interconnect PCBs
Maxwell Circuits has been building HDI boards for over 20 years. Our factory base has a broad experience producing HDI boards for different market applications. The factories in concert with our world-wide technical organization bring a comprehensive knowledge of the requirements and manufacturing methodologies required for successful HDI products. Maxwell Circuits technical support begins at the design phase of HDI PCBs where we can provide manufacturing expertise to design teams to improve manufacturability and lower overall product costs. Over 20% of our global sales are in the HDI segment which gives us the opportunity to attract the best factories in the world. We can manage local NPI and quick-turns for proof of design and bring the product to volume production off-shore seamlessly, providing a streamlined process that brings new products to market faster.
Please contact Maxwell Circuits company if you need further information or assistance, we are happy to help you.

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4L HDI – materials: Shengyi S1000-2; surface treatment: ENIG; solder mask color: black; features: epoxy hole fill, copper hole fill, BGA

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6L HDI – materials: FR-4; board thickness: 0.60mm; hole size: 0.10mm; aspect ratio: 6:1; inner and outer layer copper; 35/35 μm; line width and space: 0.076mm/0.076mm; surface treatment: OSP
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6L HDI – material: standard FR-4 ITEQ IT-158; board thickness: 1.60mm +/- 10%, BGA size: 0.30 mm, line width and space: 0.10/0.10mm; surface treatment: ENIG
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8L HDI – materials: FR-4; board thickness: 2.00mm; hole size: 0.20mm; aspect ratio: 10:1, copper thickness inner and outer layers: 35/35 μm; line width and space: 0.9/0.9mm; surface

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8L HDI – materials: FR-4 Shengyi S-1000-2; finished thickness: 1.60mm +/- 10%; BGA size: 0.25mm; line width and space: 0.10/0.10 mm; surface treatment: ENIG; features: fine pitch, copper filled via technology
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16L HDI – materials: FR-4 ITEQ IT-180A; finished board thickness: 1.75mm, surface treatment: ENIG; features: solder mask plugging, controlled impedance, control depth routing,
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HDI PCBs – Technical specification
Feature |
Maxwell Circuits´ technical specification |
Number of layers |
4 – 22 layers standard, 30 layers advanced |
Technology highlights |
Multilayer boards with a higher connection pad density than standard boards, with finer lines/spaces, smaller via holes and capture pads allowing micro-vias to only penetrate select layers and also be placed in surface pads. |
HDI builds |
1+N+1, 2+N+2, 3+N+3,4+N+4, any layer in R&D |
Materials |
FR4 standard, FR4 high performance, Halogen free FR4, Rogers |
Copper weights (finished) |
18μm – 70μm |
Minimum track and gap |
0.075mm / 0.075mm |
PCB thickness |
0.40mm – 3.20mm |
Maxmimum dimensions |
610mm x 450mm; dependant upon laser drilling machine |
Surface finishes available |
OSP, ENIG, Immersion tin, Immersion silver, Electrolytic gold, Gold fingers |
Minimum mechanical drill |
0.15mm |
Minimum laser drill |
0.10mm standard, 0.075mm advanced |
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