Technologies
The information below details some of the key capabilities that Maxwell Circuits can offer and support today. You will find information here relating to the specific materials we can support, the PCB technologies or product types which we currently produce, as well as some of the tolerances which we can achieve.
The first category is what we call "standard" and means we can offer each individual parameter from multiple sources. The second is our “advanced” offering and this shows the very best that Maxwell Circuits can offer, but here the supply chain or sourcing options is limited and in some cases this means that only one plant is capable of this parameter.
When using combinations of these parameters, you should always consult Maxwell Circuits.
CAPABILITY ROADMAP
| Feature |
2019 |
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|
Standard |
Advanced |
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| Materials | RIGID: FR2, CEM-1, CEM-3, FR4 (standard - halogen free - high performance) including: ShengYi, ITEQ, Elite Materials Corp., NanYa, Kingboard, Grace, GoWorld, TUC, Meteorwave FLEX: PI, PET including: Taiflex, Dupont FR & AP, Panasonic, ShengYi, Doosan. Hanwha, SF305 IMS: IMS Al based including: Bergquist MP, HT & CML ITEQ T-Lam, Laird TLAM SS Taiflex, Dupont FR & AP, Panasonic, ShengYi, Doosan. Please contact Maxwell Circuits for full details regarding material availability. |
RIGID: Mid – Loss material TUC TU862HF, EMC EM370D, ITEQ IT170GRA, Panasonic Megtron-2 Low – Loss material N4000-13(series), FR408HR, Megtron-4, S7038, S7439, TU872SLK (series), EM-828, EM888, N4800-20(series), I-Speed Ultra Low – Loss material Megtron-6, IT150DA, FX-2, FL-700, I-Tera, N6800-22(series), RO4350B, RO3000(series), RF-35, RF-35A2, TLX (series), AD250, FL-700LD Super Low – Loss material and High Thermal Reliability Laminate TU993, M6N, M7N,FLEX: PI, LCP including: Dupont IMS: IMS Al & Cu based including: Bergquist HPL, Ventec VT, Polytronics TCB, Doosan DST, Denka, Arlon, Chin-Shi Please contact Maxwell Circuits for full details regarding material availability. |
| Minimum dielectric thickness | 0.05mm for PCB 0.025mm for FPC |
0.025mm for PCB 0.012mm for FPC |
| Layer count | 1 - 38L / 40L QTA | 64L (pilot runs) |
| HDI / Buried - blind via | Y | Y |
| Copper filled BVH (Y/N) | Y | Y |
| Copper filled PTH (Y/N) | Y | Y - copper paste |
| Copper paste filled PTH (Y/N) | Y | Y |
| Capped via (Y/N) | Y | Y |
| LDI (Y/N) | Y | Y |
| Maximum board size (mm) | 1050 x 610 | 1400 X 610 |
| Minimum board thickness 2L (mm) |
0.15mm for PCB 0.05mm for 1L FPC 0.12mm for 2L FPC |
0.15mm for PCB 0.05mm for 1L FPC 0.12mm for 2L FPC |
| Minimum board thickness >=4L (mm) |
0.25mm for PCB 0.20 for FPC |
0.25mm for PCB 0.16 for FPC |
| Maximum board thickness (mm) | 8.6 | 10.0 |
| Minimum track / gap IL (mil)- copper weight dependent | 0.075mm | 0.05mm |
| Minimum track / gap OL (mil)- copper weight dependent | 0.075mm | 0.05mm |
| Surface finish | ENIG / GF / OSP / IAg / HASL (lead) / HASL (Leadfree) / Plating Au/Ni/ Immersion Sn / GF+OSP / GF+HASL / OSP+ENIG / IAG+GF/ ISN+GF /ENEPIG | ENIG / GF / OSP / IAg / HASL (lead) / HASL (Leadfree) / Plating Au/Ni/ Immersion Sn / GF+OSP / GF+HASL / OSP+ENIG / ENEPIG / SPF/ IAG+GF / ISN+GF |
| Layer to layer registration | 0.05mm | 25μm |
| Minimum hole (mech) (mm/mil) | 0.15mm | 0.10mm |
| Minimum hole (laser) (mm/mil) | 0.075mm | 0.05mm |
| Aspect ratio PTH | 18:1 | 20:1 |
| Aspect ratio BVH | 0.8:1 | 1.3:1 (factory + design dependent) |
| Finish hole tolerance (PTH) | ± 0.076mm | ± 0.05mm |
| Finish hole tolerance (NPTH) | ± 0.0375 | ± 0.025 |
| Maximum Cu weight OL | 12 oz | 12 oz |
| Maximum Cu weight IL | 12 oz | 12 oz |
| Controlled impedance (+/- X%) | Others ± 10% | ± 5% |
| Rigid-flex (Y/N) | Y | Y including semi flex |
| Flexible (Y/N) | Y | Y |
| IMS (Y/N) | Y (Al) | Y (both Al and Cu) |
| Embedded components (Y/N) | Y | Y |
| Soldermask via plugging IPC4761 Type VI (Y/N) | Y | Y |
| Epoxy via plugging IPC4761 Type VI (Y/N) | Y | Y |
| Epoxy via plugging IPC4761 Type VII (Y/N) | Y | Y |
| It is important to note that even with 'standard' technology this does not mean that all factories can achieve ALL of the aspects - When using combinations of these parameters, you should always consult Maxwell Circuits technical contact person. | ||